“VEGA” Porous Vitrified Bond Wheel for Wafers Finishing Grinding
Higher surface roughness realized by intermediate processing and final processing of SiC and GaN wafers
■Higher surface roughness is realized by the combination of ultra-fine diamond abrasive grains and vitrified bonds of large and fine porous combination structure.
■Spontaneous blade generation is realized and cutting quality is maintained by bonds that can make ultrafine shredding.
■Stable high-quality surface and low processing cost can be realized.
“Taffair” Porous Metal Bond Wheel for Compound Semiconductor Wafers
High grinding performance and long tool life for processing of sapphire or SiC wafers
■The porous structure of metal bonds improves biting for higher grinding performance and enhances heat dissipation for longer tool life.
■Not only abrasion resistance of highly rigid metal bonds but also maintaining of cutting quality by appropriate spontaneous blade generation are realized.
■Longer tool life contributes to the stabilization of processing quality and reduction of processing cost.
“Metarex” diamond wheels for high-efficient grinding of difficult-to-cut materials
These metal bond wheels are designed with a new concept, and have both the high cutting performance of resin bonds and the abrasion resistance of metal bonds. They are suitable for efficient grinding of difficult-to-cut materials such as Al2O3-TiC and quartz.
Diamond wheels for beveling semiconductor wafers
The "ME" and "MC4" metal bonds have higher cutting performance and durability than conventional bonds. By using a forming technology, they reduce the amount of polishing required after beveling work. Since this reduces the processing time and saves consumable supplies, the total processing cost is reduced. Wheels of desired groove shapes can be made owing to our advanced groove forming technology.Electroplated wheels using ultrafine abrasive grain are also available.
Diamond multi-layer wheels
A single wheel of this type can perform multiple grinding processes such as rough grinding, pre-finishing, and finishing. This allows multiple processes to be performed with a single machine without replacing tools, which reduces processing time. Multi-layer wheels with a combination of metal bonds for rough grinding, resin bonds for pre-finishing, and resin bonds for finishing are available.
Diamond notch wheel for semiconductor wafers
This wheel is used for the high-precision notch grinding of semiconductor wafers. Our original processing technology realizes high swinging accuracy of the diamond part against the shank. Wheels with various specifications, such as a wheel with optimized groove shape for sapphire wafers or a wheel for mirror beveling are also available.
Electroplated pad conditioning dresser for semiconductor polishing pad
This wheel is used for dressing/conditioning the polishing pads used in the flattening process of semiconductor devices.
Electroplated the appropriate abrasive grains of the selected diamond to a base metal brings stable dressing/conditioning, and results in reduced individual differences.
Work materials: Urethan pad, Non-woven fabric pad, Suede pad, which are semiconductor polishing pad
Diamond mounted wheels for interior grinding of hard brittle materials
There wheels are used for the internal grinding of precision parts as well as the precision grinding of glass, ceramics, carbon, ferrites, and gemstones. Wheels with bonds and specifications most appropriate to materials and usage can be provided.
Diamond wheel for surface grinding of hard brittle materials
This wheel is designed for surface grinding of electronic or semiconductor materials such as ceramics, quartz, and sapphires. The ""G2(G square)"" porous vitrified bond ensures high cutting performance and efficient, precision grinding can be achieved
if the wheel is combined with special segment shapes.
Diamond wheel for forming hard brittle materials
The "MF50" metal bond wheel is used for fine ceramics forming, glass substrate chamfering, and the forming of other hard brittle materials. Its advantages include high cutting performance and low grinding noise.