Longer wheel life in "rough machining" prior to surface grinding of SiC wafers

[Issue]
The production of compound semiconductor wafers, which are used as substrates for power devices, is expected to grow steadily in the trend toward power saving in a low-carbon society. The key to this growth is the processing cost of wafers, which requires a longer wheel life due to the large amount of allowance in the rough machining prior to surface grinding.


[Solution]
Our porous vitrified bond wheel "VEGA" has both a larger pore diameter and a higher porosity than conventional wheels, maximizing the biting performance to work materials. It is particularly suitable for surface grinding of SiC wafers and can grind 6" SiC wafers without dressing. The excellent wear resistance increases the number of wafers that can be machined per wheel and contributes to the reduction of wafer machining costs.

Longer wheel life in "rough machining" prior to surface grinding of SiC wafers 画像 Longer wheel life in "rough machining" prior to surface grinding of SiC wafers 画像
  • Life comparison test with conventional product

    Life comparison test with conventional product 画像
  • Processing condition

    Machine        : High rigidity grinder

    Wheel spec.  : #2000 Vitrified bond

    Material         : 6inch SiC (C)


Applicable tool

“VEGA” Porous vitrified bond wheel for compound semiconductor wafers


[Product specifications]
Bond : Porous vitrified bond
Grain size : #1000~#3000

[Applied materials]
SiC, GaN, GaAs, LT/LN

■The biting performance to work materials is maximized by both a larger pore diameter and a higher porosity than conventional wheels.
■Spontaneous blade generation is realized and cutting quality is maintained by bonds that can make ultrafine shredding.
■Stable high-quality surface and low processing cost can be realized.