Electroplated pad conditioning dresser for semiconductor polishing pad

This wheel is used for dressing/conditioning the polishing pads used in the flattening process of semiconductor devices.
Electroplated the appropriate abrasive grains of the selected diamond to a base metal brings stable dressing/conditioning, and results in reduced individual differences.

Work materials: Urethan pad, Non-woven fabric pad, Suede pad, which are semiconductor polishing pad

Electroplated pad conditioning dresser for semiconductor polishing pad img
  • Rage of abrasive grain mesh size (Ave. size)

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  • Specification

    *Outer Diameter: ~φ740D(29B)
    *Base accuracy: Flatness ≤ 0.3 Set tolerance ≤ 0.05
    *Base materials: SUS304, SUS420
    *Base coating: With or without Teflon coating
    *Electroplated surface: One side or both side
    *Abrasive grain: Diamond (Blocky type and others)
    *Particle size: #60 ~ 400

Bond
Electroplated
Industories
SemiconductorSemiconductor device
Work materials
Resin / Fabric
Processing methods
Grinding