Electroplated pad conditioning dresser for semiconductor polishing pad
This wheel is used for dressing/conditioning the polishing pads used in the flattening process of semiconductor devices.
Electroplated the appropriate abrasive grains of the selected diamond to a base metal brings stable dressing/conditioning, and results in reduced individual differences.
Work materials: Urethan pad, Non-woven fabric pad, Suede pad, which are semiconductor polishing pad
Rage of abrasive grain mesh size (Ave. size)
*Outer Diameter: ~φ740D(29B) *Base accuracy: Flatness ≤ 0.3 Set tolerance ≤ 0.05 *Base materials: SUS304, SUS420 *Base coating: With or without Teflon coating *Electroplated surface: One side or both side *Abrasive grain: Diamond (Blocky type and others) *Particle size: #60 ~ 400
- Work materials
- Processing methods