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Diamond wheels for beveling semiconductor wafers

Diamond wheels for beveling semiconductor wafers

Product summary

The "ME" and "MC4" metal bonds have higher cutting performance and durability than conventional bonds. By using a forming technology, they reduce the amount of polishing required after beveling work. Since this reduces the processing time and saves consumable supplies, the total processing cost is reduced. Wheels of desired groove shapes can be made owing to our advanced groove forming technology.Electroplated wheels using ultrafine abrasive grain are also available.

Details of a product

Diamond wheels for beveling semiconductor wafers
Diamond wheels for beveling semiconductor wafers

Component Material of the Tools・Bond

Metal bond ME
Metal bond MC4

Use

Semiconductor wafers

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