SEMICON Japan 2023 Exhibition Report
We had exhibited at "SEMICON Japan 2023" which was held at Tokyo Big Sight between, 13th to 15th December, 2023.
We Tokyo Diamond Tools Mfg were showing the Diamond Wheels, which were ideal for processing SiC wafers and silicon wafers used in semiconductor materials, as well as quartz and ceramics used in semiconductor manufacturing equipment (SPE).
We highly appreciate everyone who stopped by our booth.
Diamond cutting wheel for precision cutting
Precision blade for cutting package substrates. Stable sharpness prevents chipping and chipping of package substrates without reducing sharpness due to copper adhesion.
High-precision edge grinding wheel, with improved machining accuracy and wheel life
A high-precision edge grinding wheel that improves wafer processing accuracy and wheel life by improving the groove accuracy of the wheel. Groove accuracy and groove bottom geometric tolerance have been significantly improved compared to conventional products.
Pad dresser for polishing pads
By electroplating selected diamond abrasive grains to the base metal, stable dressing is achieved. It is useful for dressing polishing pads used in the planarization process of semiconductor devices.
Vitrified bond wheel for wafer grinding
A new bond wheel developed using unique grinding wheel texture control technology. Rough surface grinding of SiC wafers achieves both workability and wheel life.
SEMICON Japan 2023 Digest
|SEMICON Japan 2023
|December 13-15, 2023
|Tokyo Big Sight
Are there any issues with processing semiconductor materials or manufacturing equipment?
We Tokyo Diamond Tool Mfg. contribute to improve the efficiency of semiconductor manufacturing sites with a variety of highly efficient and stable diamond wheels. If you have any issues with processing semiconductor materials or semiconductor manufacturing equipment, please feel free to contact us.