"Copper-free" metal bond wheel with spindle for semiconductor manufacturing equipment components

This is a copper-free metal bond wheel with spindle that limits the use of copper and steel in the bond.
The "copper free" wheel uses a unique bond formulation to achieve mechanical properties comparable to those of bronze-based bonds without the use of copper.
In machining tests, it has a grindability and lifespan comparable to that of bronze-based bonds.
The use of copper-free wheels prevents copper contamination of workpieces when machining jigs used in the preprocessing of semiconductors, which are particularly sensitive to copper contamination, and reduces the need for cleaning and removal processes in subsequent processes.
"Copper-free" metal bond wheel with spindle for semiconductor manufacturing equipment components img

Comparison of grinding resistance with conventional bronze-based bonds

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[Test machining conditions]
Machine: Gliding center
Rotation speed: 3200 rpm
Feed rate: 200 mm/min
Depth of cut: 30 μm/pass
Coolant Water soluble coolant
Workpiece SiC ceramics

[Test wheel specifications]
Particle size: #50
Size: 30D-10T-5W-6Y-40L 

[Applicable size and specifications of wheel with spindle*For reference
Wheel outer diameter: f50 or less
Wheel T-dimension: 30T or less
Wheel length: 100L or less
Particle size: #50-


Bond

Metal bond

Industories
SemiconductorSemiconductor equipment
Work materials
Ceramics
Processing methods
Grinding