PCD small-diameter drill / Polycrystalline diamond small-diameter drillThis is a small-diameter drill using PCD/polycrystalline diamond for the cutting edge, and is suitable for continuous hole drilling in silicon. The spiral grooves provide good chip evacuation and reduce the frequency of step machining.
“Metarex” diamond wheels for high-efficient grinding of difficult-to-cut materialsThese metal bond wheels are designed with a new concept, and have both the high cutting performance of resin bonds and the abrasion resistance of metal bonds. They are suitable for efficient grinding of difficult-to-cut materials such as Al2O3-TiC and quartz.
Diamond core drillDiamond core drills were originally designed for drilling and coring of hard and brittle materials, but their use is now expanding to include the shape machining of hard materials such as ceramics on machining and gliding centers.
The coolant is supplied with a center-through structure, which allows chips to escape easily and reduces damage to the tool and workpiece caused by the chips, thus enabling highly efficient machining.
This tool is ideal for spot facing by helical grinding in narrow widths where chips tend to accumulate.
We offer the most suitable shape for high-efficiency drilling of ceramics.
The strong bond bridge structure ensures long life and stable cutting performance.
Metal bond mounted wheels for machining of hard and brittle materialsDiamond metal bond wheels with spindle are specially designed for machining hard and brittle materials.
We offer the most suitable bond specifications for various materials in the grinding process of hard and brittle materials using a machining/gliding center.
The metal bond wheel has high abrasive grain retention and high sharpness even when machining hard materials. It also has good thermal conductivity, which prevents heat buildup at the machining point and prevents thermal cracking of brittle materials. The tool life is longer than that of electrodeposition tools with a single diamond layer, and it is the best tool for machining ceramics, especially hard SiC and aluminum nitride.
In the machining of quartz glass, the optimum bond selection ensures high grinding durability.
Diamond / CBN mounted wheelsThese wheels are used for the internal grinding of precision parts and precision machining of glass, ceramics, carbon, ferrite, and precious stones. We provide wheels with the most suitable bond and specifications for the work material and application.
Metal bonds are ideal for machining hard and brittle materials. It is especially suitable for machining fine ceramics such as silicon carbide (SiC), aluminum nitride (AlN), silicon nitride (SiN), and quartz glass.
The electrodeposition bond has good sharpness and versatility, and can be used not only for hard and brittle materials but also for carbon, ferrite, MMC materials, FRP, and cemented carbide.
Resin bond is used for the purpose of reducing damage such as chipping of the workpiece and for finishing processes that require surface roughness.
It is also possible to manufacture wheels with spindles with an outer diameter of φ100 or larger by joining a straight wheel or cup wheel to the spindle. Please consult with us for such products.
"Copper-free" metal bond wheel with spindle for semiconductor manufacturing equipment componentsThis is a copper-free metal bond wheel with spindle that limits the use of copper and steel in the bond.
The "copper free" wheel uses a unique bond formulation to achieve mechanical properties comparable to those of bronze-based bonds without the use of copper.
In machining tests, it has a grindability and lifespan comparable to that of bronze-based bonds.
The use of copper-free wheels prevents copper contamination of workpieces when machining jigs used in the preprocessing of semiconductors, which are particularly sensitive to copper contamination, and reduces the need for cleaning and removal processes in subsequent processes.
Diamond wheel for surface grinding of hard brittle materialsThis wheel is designed for surface grinding of electronic or semiconductor materials such as ceramics, quartz, and sapphires. The ""G2(G square)"" porous vitrified bond ensures high cutting performance and efficient, precision grinding can be achieved
if the wheel is combined with special segment shapes.
Diamond wheel for forming hard brittle materialsThe "MF50" metal bond wheel is used for fine ceramics forming, glass substrate chamfering, and the forming of other hard brittle materials. Its advantages include high cutting performance and low grinding noise.
Diamond / CBN wheels for grinding with formed toolsThis wheels is used for forming / grooving of fine ceramics, quartz and other hard brittle materials and high-speed steel, and chamfering of glass substrates.
The "MB" bond series is a resin bond wheel with high shape retention using heat-resistant resin and metal filler. It has high sharpness and high shape retention in heavy-duty grinding with a large depth of cut.
The ability to form by electrical discharge machining makes it possible to form differently shaped abrasive grain layers, which are usually difficult to form, making this bond very suitable for machining with formed tools in plunge grinding.
The "MB" bond series is a bond that works well with both diamond and CBN wheels.
The diamond wheels are suitable for machining with formed tools for quartz, ceramics, and cemented carbides.
CBN wheels are suitable for the machining of high-speed steel blades and for machining with formed tools for iron-based machine parts that require high accuracy.
Since the wheels are heat resistant and capable of heavy-duty grinding, we have experience in machining with formed tools using multi-wheels that combine several wheels.
Diamond pellet wheel for surface grinding of hard brittle materialsThis wheel takes full advantage of aligned pellets for large-area surface grinding of materials such as quartz and ceramics in situations where flatness and cutting performance are required. Various pellet shapes and bonds are available to meet material features and wheel usage requirements.