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“Taffair” Porous Metal Bond Wheel for Semiconductor Wafers

“Taffair” Porous Metal Bond Wheel for Semiconductor Wafers

High grinding performance and long tool life for processing of sapphire or SiC wafers
■The porous structure of metal bonds improves biting for higher grinding performance and enhances heat dissipation for longer tool life.
■Not only abrasion resistance of highly rigid metal bonds but also maintaining of cutting quality by appropriate spontaneous blade generation are realized.
■Longer tool life contributes to the stabilization of processing quality and reduction of processing cost.

Large Size Resin Bond Wheel

Large Size Resin Bond Wheel

■ Single-piece formation of a resin bond wheel with a maximum outer diameter of φ600mm and width of T100mm can be realized.
■ Grinding trace at joint is eliminated.
■ Dynamic balance of 0.1μm is realized for products with a dedicated flange.

“DEX FF” Fine Diamond Electroplated Wheel for Finishing

“DEX FF” Fine Diamond Electroplated Wheel for Finishing

High-quality finishing is realized by electroplating fine abrasive grains of around #1000~#2000.
■ High-quality finishing is realized with good surface roughness and less tipping.
■ High ability of maintaining the wheel shape realizes high-precision shape forming.
■ Multi-layered electroplating can be conducted to extend the life of the wheel.

“Chemex” Resin Bond Wheel for Wafers Polishing Grinding

“Chemex” Resin Bond Wheel for Wafers Polishing Grinding

“Chemex” resin bond wheel realizing fixed abrasive in silicon wafer polishing
■“Chemex” wheel uses chemical action together with mechanical action to realize fixed abrasive polishing instead of conventional loose abrasive polishing.
■The target is to achieve high-quality surface like slurry.
■Wheels of the structure most suitable for work material or purpose can be proposed.

“VEGA” Porous Vitrified Bond Wheel for Wafers Finishing Grinding

“VEGA” Porous Vitrified Bond Wheel for Wafers Finishing Grinding

Higher surface roughness realized by intermediate processing and final processing of silicon and SiC wafers
■Higher surface roughness is realized by the combination of ultra-fine diamond abrasive grains and vitrified bonds of large and fine porous combination structure.
■Spontaneous blade generation is realized and cutting quality is maintained by bonds that can make ultrafine shredding.
■Stable high-quality surface and low processing cost can be realized.

“Metarex” diamond wheels for high-efficient grinding of difficult-to-cut materials

“Metarex” diamond wheels for high-efficient grinding of difficult-to-cut materials

These metal bond wheels are designed with a new concept, and have both the high cutting performance of resin bonds and the abrasion resistance of metal bonds. They are suitable for efficient grinding of difficult-to-cut materials such as Al2O3-TiC and quartz.

Diamond pellet wheel for surface grinding of hard brittle materials

Diamond pellet wheel for surface grinding of hard brittle materials

This wheel takes full advantage of aligned pellets for large-area surface grinding of materials such as quartz and ceramics in situations where flatness and cutting performance are required. Various pellet shapes and bonds are available to meet material features and wheel usage requirements.

Diamond wheel for surface grinding of hard brittle materials

Diamond wheel for surface grinding of hard brittle materials

This wheel is designed for surface grinding of electronic or semiconductor materials such as ceramics, quartz, and sapphires. The ""G2(G square)"" porous vitrified bond ensures high cutting performance and efficient, precision grinding can be achieved
if the wheel is combined with special segment shapes.

“DEX” diamond wheel for optical lens centering

“DEX” diamond wheel for optical lens centering

This wheel is used for axis alignment (optical lens centering) of aspherical lenses or steppers used in high-grade cameras or endoscopes, which usually require high-precision grinding. When used, pre-conditioning grinding is not necessary and lens manufacturing with less damage on the lens edge starts from the beginning of processing work. The wheel can also suppress lens coloring, even when a steep rise shape is used.

Diamond cutting wheels

Diamond cutting wheels

These wheels are used for cutting and grooving carbide alloys, cermet, ceramics, glass, ferrites, semiconductors, carbon, and other non-iron metal materials. They realize less bending and a higher quality cutting surface. A resin bond CBN wheel is provided for cutting magnetic materials.