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“Taffair” Porous Metal Bond Wheel for Semiconductor Wafers

“Taffair” Porous Metal Bond Wheel for Semiconductor Wafers

High grinding performance and long tool life for processing of sapphire or SiC wafers
■The porous structure of metal bonds improves biting for higher grinding performance and enhances heat dissipation for longer tool life.
■Not only abrasion resistance of highly rigid metal bonds but also maintaining of cutting quality by appropriate spontaneous blade generation are realized.
■Longer tool life contributes to the stabilization of processing quality and reduction of processing cost.

Large Size Resin Bond Wheel

Large Size Resin Bond Wheel

■ Single-piece formation of a resin bond wheel with a maximum outer diameter of φ600mm and width of T100mm can be realized.
■ Grinding trace at joint is eliminated.
■ Dynamic balance of 0.1μm is realized for products with a dedicated flange.

“DEX FF” Fine Diamond Electroplated Wheel for Finishing

“DEX FF” Fine Diamond Electroplated Wheel for Finishing

High-quality finishing is realized by electroplating fine abrasive grains of around #1000~#2000.
■ High-quality finishing is realized with good surface roughness and less tipping.
■ High ability of maintaining the wheel shape realizes high-precision shape forming.
■ Multi-layered electroplating can be conducted to extend the life of the wheel.

“DEX Duo” Electroplated Wheel for Hard Brittle Materials

“DEX Duo” Electroplated Wheel for Hard Brittle Materials

■Structure density is made finer by laminating electroplated abrasive grains of different sizes.
■Finer abrasive grain structure realizes persistence of the grinding performance of the diamond abrasive grains and longer tool life.
■The long tool life stabilizes the processing quality.

“Gran DEX” Electroplated Wheel for Hard Brittle Material

“Gran DEX” Electroplated Wheel for Hard Brittle Material

■ Abrasive grain intervals are widened by controlling the abrasive grain density in the electroplating. This can reduce grinding resistance during rough grinding of hard, brittle materials such as glass or ceramics, and realize high-level cutting performance even in deep grinding.
■ Life of the wheel is extended significantly with tipping and surface roughness maintained at the same level as in conventional electroplated wheels.
■ Clogging can be reduced by widening the abrasive grain interval.

“DEX” diamond wheels for forming difficult-to-cut materials

“DEX” diamond wheels for forming difficult-to-cut materials

These wheels are designed for high shape precision forming of, for example, motor cores. Wheels of the most appropriate specifications are available for not only magnetic materials such as neodymium-iron, but also for ferrites, ceramics and glass.

Diamond mounted wheels for interior grinding of hard brittle materials

Diamond mounted wheels for interior grinding of hard brittle materials

There wheels are used for the internal grinding of precision parts as well as the precision grinding of glass, ceramics, carbon, ferrites, and gemstones. Wheels with bonds and specifications most appropriate to materials and usage can be provided.

Diamond cutting wheels

Diamond cutting wheels

These wheels are used for cutting and grooving carbide alloys, cermet, ceramics, glass, ferrites, semiconductors, carbon, and other non-iron metal materials. They realize less bending and a higher quality cutting surface. A resin bond CBN wheel is provided for cutting magnetic materials.

CBN cutting wheels

CBN cutting wheels

These high-efficiency cutting wheels are suitable for high-quality cutting of magnetic materials, ceramics, and glass. Their high cutting performance improves cutting surface quality and hence work quality.

Diamond multi-cutting wheel

Diamond multi-cutting wheel

This wheel is a high-precision assembly consisting of multiple cutters (blades) that simultaneously machines complex form products of quartz, ceramics, ferrites, glass, and carbide alloys.