“Taffair” Porous Metal Bond Wheel for Semiconductor Wafers
High grinding performance and long tool life for processing of sapphire or SiC wafers
■The porous structure of metal bonds improves biting for higher grinding performance and enhances heat dissipation for longer tool life.
■Not only abrasion resistance of highly rigid metal bonds but also maintaining of cutting quality by appropriate spontaneous blade generation are realized.
■Longer tool life contributes to the stabilization of processing quality and reduction of processing cost.
“DEX FF” Fine Diamond Electroplated Wheel for Finishing
High-quality finishing is realized by electroplating fine abrasive grains of around #1000～#2000.
■ High-quality finishing is realized with good surface roughness and less tipping.
■ High ability of maintaining the wheel shape realizes high-precision shape forming.
■ Multi-layered electroplating can be conducted to extend the life of the wheel.
“DEX Duo” Electroplated Wheel for Hard Brittle Materials
“Gran DEX” Electroplated Wheel for Hard Brittle Material
■ Abrasive grain intervals are widened by controlling the abrasive grain density in the electroplating. This can reduce grinding resistance during rough grinding of hard, brittle materials such as glass or ceramics, and realize high-level cutting performance even in deep grinding.
■ Life of the wheel is extended significantly with tipping and surface roughness maintained at the same level as in conventional electroplated wheels.
■ Clogging can be reduced by widening the abrasive grain interval.