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Large Size Resin Bond Wheel

Large Size Resin Bond Wheel

■ Single-piece formation of a resin bond wheel with a maximum outer diameter of φ600mm and width of T100mm can be realized.
■ Grinding trace at joint is eliminated.
■ Dynamic balance of 0.1μm is realized for products with a dedicated flange.

“DEX Duo” Electroplated Wheel for Hard Brittle Materials

“DEX Duo” Electroplated Wheel for Hard Brittle Materials

■Structure density is made finer by laminating electroplated abrasive grains of different sizes.
■Finer abrasive grain structure realizes persistence of the grinding performance of the diamond abrasive grains and longer tool life.
■The long tool life stabilizes the processing quality.

“Gran DEX” Electroplated Wheel for Hard Brittle Material

“Gran DEX” Electroplated Wheel for Hard Brittle Material

■ Abrasive grain intervals are widened by controlling the abrasive grain density in the electroplating. This can reduce grinding resistance during rough grinding of hard, brittle materials such as glass or ceramics, and realize high-level cutting performance even in deep grinding.
■ Life of the wheel is extended significantly with tipping and surface roughness maintained at the same level as in conventional electroplated wheels.
■ Clogging can be reduced by widening the abrasive grain interval.

“Hi-PAX” PCD chip saws

“Hi-PAX” PCD chip saws

These chip saws are edged with PCD (polycrystalline diamond) and can produce finer surfaces than carbide tools while lasting ten times as long. They are effective for cutting and grooving of architecture materials, wood, aluminum alloys, glass fiber composite materials, rubbers, and plastics.

Diamond dry bits

Diamond dry bits

These diamond dry drill bits are suitable for drilling work in situations where coolant (cooling water) cannot be used. They are used frequently for reforming existing buildings. Mole bits are also available for drilling reinforced concrete.