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“Taffair” Porous Metal Bond Wheel for Semiconductor Wafers

“Taffair” Porous Metal Bond Wheel for Semiconductor Wafers

High grinding performance and long tool life for processing of sapphire or SiC wafers
■The porous structure of metal bonds improves biting for higher grinding performance and enhances heat dissipation for longer tool life.
■Not only abrasion resistance of highly rigid metal bonds but also maintaining of cutting quality by appropriate spontaneous blade generation are realized.
■Longer tool life contributes to the stabilization of processing quality and reduction of processing cost.

Large Size Resin Bond Wheel

Large Size Resin Bond Wheel

■ Single-piece formation of a resin bond wheel with a maximum outer diameter of φ600mm and width of T100mm can be realized.
■ Grinding trace at joint is eliminated.
■ Dynamic balance of 0.1μm is realized for products with a dedicated flange.

“DEX FF” Fine Diamond Electroplated Wheel for Finishing

“DEX FF” Fine Diamond Electroplated Wheel for Finishing

High-quality finishing is realized by electroplating fine abrasive grains of around #1000~#2000.
■ High-quality finishing is realized with good surface roughness and less tipping.
■ High ability of maintaining the wheel shape realizes high-precision shape forming.
■ Multi-layered electroplating can be conducted to extend the life of the wheel.

“DEX Duo” Electroplated Wheel for Hard Brittle Materials

“DEX Duo” Electroplated Wheel for Hard Brittle Materials

■Structure density is made finer by laminating electroplated abrasive grains of different sizes.
■Finer abrasive grain structure realizes persistence of the grinding performance of the diamond abrasive grains and longer tool life.
■The long tool life stabilizes the processing quality.

“Gran DEX” Electroplated Wheel for Hard Brittle Material

“Gran DEX” Electroplated Wheel for Hard Brittle Material

■ Abrasive grain intervals are widened by controlling the abrasive grain density in the electroplating. This can reduce grinding resistance during rough grinding of hard, brittle materials such as glass or ceramics, and realize high-level cutting performance even in deep grinding.
■ Life of the wheel is extended significantly with tipping and surface roughness maintained at the same level as in conventional electroplated wheels.
■ Clogging can be reduced by widening the abrasive grain interval.

“Chemex” Resin Bond Wheel for Wafers Polishing Grinding

“Chemex” Resin Bond Wheel for Wafers Polishing Grinding

“Chemex” resin bond wheel realizing fixed abrasive in silicon wafer polishing
■“Chemex” wheel uses chemical action together with mechanical action to realize fixed abrasive polishing instead of conventional loose abrasive polishing.
■The target is to achieve high-quality surface like slurry.
■Wheels of the structure most suitable for work material or purpose can be proposed.

“VEGA” Porous Vitrified Bond Wheel for Wafers Finishing Grinding

“VEGA” Porous Vitrified Bond Wheel for Wafers Finishing Grinding

Higher surface roughness realized by intermediate processing and final processing of silicon and SiC wafers
■Higher surface roughness is realized by the combination of ultra-fine diamond abrasive grains and vitrified bonds of large and fine porous combination structure.
■Spontaneous blade generation is realized and cutting quality is maintained by bonds that can make ultrafine shredding.
■Stable high-quality surface and low processing cost can be realized.

Diamond wheel for chamfering glass substrates

Diamond wheel for chamfering glass substrates

This chamfering wheel is designed to maintain substrate strength when fabricating glass display panels. Wheels for facilitating high-speed substrate feeding are available for various machines.

Diamond wheel for forming hard brittle materials

Diamond wheel for forming hard brittle materials

The "MF50" metal bond wheel is used for fine ceramics forming, glass substrate chamfering, and the forming of other hard brittle materials. Its advantages include high cutting performance and low grinding noise.

“DEX” diamond wheels for chamfering glass disks

“DEX” diamond wheels for chamfering glass disks

These wheels are used to chamfer the inner diameter (ID) or outer diameter (OD) edge of glass disks. Due to the special electroplating used in this design, the roughness of chamfered surfaces are improved and chipping at the boundary area to the edge surface is minimized. Wheels using micron size abrasive grain are available.