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“Taffair” Porous Metal Bond Wheel for Semiconductor Wafers

“Taffair” Porous Metal Bond Wheel for Semiconductor Wafers

High grinding performance and long tool life for processing of sapphire or SiC wafers
■The porous structure of metal bonds improves biting for higher grinding performance and enhances heat dissipation for longer tool life.
■Not only abrasion resistance of highly rigid metal bonds but also maintaining of cutting quality by appropriate spontaneous blade generation are realized.
■Longer tool life contributes to the stabilization of processing quality and reduction of processing cost.

Large Size Resin Bond Wheel

Large Size Resin Bond Wheel

■ Single-piece formation of a resin bond wheel with a maximum outer diameter of φ600mm and width of T100mm can be realized.
■ Grinding trace at joint is eliminated.
■ Dynamic balance of 0.1μm is realized for products with a dedicated flange.

“DEX FF” Fine Diamond Electroplated Wheel for Finishing

“DEX FF” Fine Diamond Electroplated Wheel for Finishing

High-quality finishing is realized by electroplating fine abrasive grains of around #1000~#2000.
■ High-quality finishing is realized with good surface roughness and less tipping.
■ High ability of maintaining the wheel shape realizes high-precision shape forming.
■ Multi-layered electroplating can be conducted to extend the life of the wheel.

“DEX Duo” Electroplated Wheel for Hard Brittle Materials

“DEX Duo” Electroplated Wheel for Hard Brittle Materials

■Structure density is made finer by laminating electroplated abrasive grains of different sizes.
■Finer abrasive grain structure realizes persistence of the grinding performance of the diamond abrasive grains and longer tool life.
■The long tool life stabilizes the processing quality.

“Gran DEX” Electroplated Wheel for Hard Brittle Material

“Gran DEX” Electroplated Wheel for Hard Brittle Material

■ Abrasive grain intervals are widened by controlling the abrasive grain density in the electroplating. This can reduce grinding resistance during rough grinding of hard, brittle materials such as glass or ceramics, and realize high-level cutting performance even in deep grinding.
■ Life of the wheel is extended significantly with tipping and surface roughness maintained at the same level as in conventional electroplated wheels.
■ Clogging can be reduced by widening the abrasive grain interval.

“VEGA” Porous Vitrified Bond Wheel for Wafers Finishing Grinding

“VEGA” Porous Vitrified Bond Wheel for Wafers Finishing Grinding

Higher surface roughness realized by intermediate processing and final processing of silicon and SiC wafers
■Higher surface roughness is realized by the combination of ultra-fine diamond abrasive grains and vitrified bonds of large and fine porous combination structure.
■Spontaneous blade generation is realized and cutting quality is maintained by bonds that can make ultrafine shredding.
■Stable high-quality surface and low processing cost can be realized.

“Metarex” diamond wheels for high-efficient grinding of difficult-to-cut materials

“Metarex” diamond wheels for high-efficient grinding of difficult-to-cut materials

These metal bond wheels are designed with a new concept, and have both the high cutting performance of resin bonds and the abrasion resistance of metal bonds. They are suitable for efficient grinding of difficult-to-cut materials such as Al2O3-TiC and quartz.

Diamond pellet wheel for surface grinding of hard brittle materials

Diamond pellet wheel for surface grinding of hard brittle materials

This wheel takes full advantage of aligned pellets for large-area surface grinding of materials such as quartz and ceramics in situations where flatness and cutting performance are required. Various pellet shapes and bonds are available to meet material features and wheel usage requirements.

Diamond wheel for surface grinding of hard brittle materials

Diamond wheel for surface grinding of hard brittle materials

This wheel is designed for surface grinding of electronic or semiconductor materials such as ceramics, quartz, and sapphires. The ""G2(G square)"" porous vitrified bond ensures high cutting performance and efficient, precision grinding can be achieved
if the wheel is combined with special segment shapes.

Diamond wheels for mirror finishing of difficult-to-cut materials

Diamond wheels for mirror finishing of difficult-to-cut materials

"BL" porous resin bond wheels are designed for mirror grinding of carbide alloy molds, ceramics, silicon wafers, and hardening steel alloys. With the effect of pores and a heat-resistant bond strengthened by special filler, these wheels produce high quality finished surfaces while maintaining their cutting performance.