“Taffair” Porous Metal Bond Wheel for Semiconductor Wafers
High grinding performance and long tool life for processing of sapphire or SiC wafers
■The porous structure of metal bonds improves biting for higher grinding performance and enhances heat dissipation for longer tool life.
■Not only abrasion resistance of highly rigid metal bonds but also maintaining of cutting quality by appropriate spontaneous blade generation are realized.
■Longer tool life contributes to the stabilization of processing quality and reduction of processing cost.
Single Grained Metal Bond Wheel for Machining Aluminum Block
■Wheel of an alloy base where coarse abrasive grains are regularly placed with metal bond.
■Large protrusion of abrasive grains realizes smaller grinding resistance by 30-40% than that of the electroplated wheel of the same size and improves the grinding performance.
■Realizes machining with higher surface precision than cutting, and is effective for plane machining of mating surfaces of aluminum parts.
Large Size Resin Bond Wheel
“DTFC”” Mounted Wheel/Cutting Wheel for Cutting/Grinding CFRP “
■Significantly suppresses burr and peel ply (delamination) and realizes high-quality and high-precision machining.
■Reduces mass production cost by removing manual finishing process, realizing long product life, and reusing by re-electroplate.
■Reduction of manual finishing process can suppress precision variation and is effective for finishing junctions which require high precision.
“DEX FF” Fine Diamond Electroplated Wheel for Finishing
High-quality finishing is realized by electroplating fine abrasive grains of around #1000～#2000.
■ High-quality finishing is realized with good surface roughness and less tipping.
■ High ability of maintaining the wheel shape realizes high-precision shape forming.
■ Multi-layered electroplating can be conducted to extend the life of the wheel.
“DEX Duo” Electroplated Wheel for Hard Brittle Materials
“Gran DEX” Electroplated Wheel for Hard Brittle Material
■ Abrasive grain intervals are widened by controlling the abrasive grain density in the electroplating. This can reduce grinding resistance during rough grinding of hard, brittle materials such as glass or ceramics, and realize high-level cutting performance even in deep grinding.
■ Life of the wheel is extended significantly with tipping and surface roughness maintained at the same level as in conventional electroplated wheels.
■ Clogging can be reduced by widening the abrasive grain interval.
“Metalist” CBN Metal Bond Wheel for Iron Material
By using the metal bond having significantly higher heat conduction than a vitrified bond, the influence of heat on the working surface is minimized.
■ The product not only maintains cutting performance and realizes long tool life, but also suppresses burning of work materials.
■ Since it can suppress heat stress on work materials more than conventional abrasive wheels, reduction of the fatigue-resistant strength of the work can be suppressed.
■ Little damage on abrasive grains and appropriate spontaneous blade generation can realize long dress intervals and reduce down time.
“Chemex” Resin Bond Wheel for Wafers Polishing Grinding
“Chemex” resin bond wheel realizing fixed abrasive in silicon wafer polishing
■“Chemex” wheel uses chemical action together with mechanical action to realize fixed abrasive polishing instead of conventional loose abrasive polishing.
■The target is to achieve high-quality surface like slurry.
■Wheels of the structure most suitable for work material or purpose can be proposed.
“VEGA” Porous Vitrified Bond Wheel for Wafers Finishing Grinding
Higher surface roughness realized by intermediate processing and final processing of silicon and SiC wafers
■Higher surface roughness is realized by the combination of ultra-fine diamond abrasive grains and vitrified bonds of large and fine porous combination structure.
■Spontaneous blade generation is realized and cutting quality is maintained by bonds that can make ultrafine shredding.
■Stable high-quality surface and low processing cost can be realized.