Improved edge strength in cover glass chamfering for smartphones and other information terminals
Cover glass for smartphones and other devices, which are becoming thinner and lighter, needs to be chamfered to suppress micro-cracks and increase edge strength.
In the chamfering process of cover glass, switching from inexpensive electroplated wheels widely used today to our metal bond wheels, can improve the edge strength by suppressing micro-cracks.
The chamfering by the metal bond wheel provides excellent roughness of the machined surface and nearly three times the end-face strength compared to chamfering by the electroplated wheel. In addition, the metal bond chamfering wheel realizes high-precision form grinding, improves machining efficiency, and has a long service life with sustained cutting performance.
Comparison of end-face strength (the average of 4 point bending strength) after chamfering by electr
Pressing speed : 8mm/min
Grain size of the electroplated wheel : #800
Grain size of the metal bond wheel : #600
Metal bond mounted wheel for chamfering glass
[Example of product specifications]
Bond : “ME” or “123C” metal bond
Grain size : #800 or #600 (for rough grinding)
A high-precision formed wheel is necessary for efficient chamfering. Using our original machining technology, we are able to manufacture formed metal bond wheels that can realize high-precision forming of shapes.
In addition, metal bond wheels are self-sharpening and have a durable cutting ability and long life.