“VEGA” Porous Vitrified Bond Wheel for Wafers Finishing Grinding
Higher surface roughness realized by intermediate processing and final processing of silicon and SiC wafers
■Higher surface roughness is realized by the combination of ultra-fine diamond abrasive grains and vitrified bonds of large and fine porous combination structure.
■Spontaneous blade generation is realized and cutting quality is maintained by bonds that can make ultrafine shredding.
■Stable high-quality surface and low processing cost can be realized.
“Metarex” diamond wheels for high-efficient grinding of difficult-to-cut materials
Diamond pellet wheel for surface grinding of hard brittle materials
Diamond wheel for surface grinding of hard brittle materials
This wheel is designed for surface grinding of electronic or semiconductor materials such as ceramics, quartz, and sapphires. The ""G2(G square)"" porous vitrified bond ensures high cutting performance and efficient, precision grinding can be achieved
if the wheel is combined with special segment shapes.
Diamond wheels for mirror finishing of difficult-to-cut materials
"BL" porous resin bond wheels are designed for mirror grinding of carbide alloy molds, ceramics, silicon wafers, and hardening steel alloys. With the effect of pores and a heat-resistant bond strengthened by special filler, these wheels produce high quality finished surfaces while maintaining their cutting performance.
“DEX” diamond wheels for forming difficult-to-cut materials
“Lenelas” diamond high-elasticity wheel for finishing
This wheel has high abrasion resistance because it uses a high-elasticity resin bond made with a special bonding agent. It realizes surface roughness of the same level as final lapping or polishing in a short period of time. By varying the bond content, it can be used to process different materials such as glass, metal, and ceramics. There are two types of bonds available: "RN" bond for better grinding performance and "RP" bond for better surface roughness.