Diamond wheels for beveling semiconductor wafers

The "ME" and "MC4" metal bonds have higher cutting performance and durability than conventional bonds. By using a forming technology, they reduce the amount of polishing required after beveling work. Since this reduces the processing time and saves consumable supplies, the total processing cost is reduced. Wheels of desired groove shapes can be made owing to our advanced groove forming technology.Electroplated wheels using ultrafine abrasive grain are also available.

Diamond wheels for beveling semiconductor wafers img
  • Surface roughness comparison of grinding test of silicon wafer(after 120 pcs)

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  • Load current transition of grinding test of silicon wafer

Bond
Metal bond ME、Metal bond MC4
Industories
SemiconductorSemiconductor device
Work materials
Semiconductor materials
Processing methods
Grinding