Japanes
English
Thai

“Chemex” Resin Bond Wheel for Wafers Polishing Grinding

“Chemex” Resin Bond Wheel for Wafers Polishing Grinding

Product summary

“Chemex” resin bond wheel realizing fixed abrasive in silicon wafer polishing
■“Chemex” wheel uses chemical action together with mechanical action to realize fixed abrasive polishing instead of conventional loose abrasive polishing.
■The target is to achieve high-quality surface like slurry.
■Wheels of the structure most suitable for work material or purpose can be proposed.

Component Material of the Tools・Bond

Resin bond

Use

Glass、Semiconductor wafers、Quartz、Polycrystalline silicon

Contact Us