Higher surface roughness realized by intermediate processing and final processing of silicon and SiC wafers
■Higher surface roughness is realized by the combination of ultra-fine diamond abrasive grains and vitrified bonds of large and fine porous combination structure.
■Spontaneous blade generation is realized and cutting quality is maintained by bonds that can make ultrafine shredding.
■Stable high-quality surface and low processing cost can be realized.
Details of a product
Wheel Spec. : SD6000 VZP-20 φ300D
Machine : Vertical Grinder @ NTS
Material : 12” Silicon Wafer 1pc/batch
Pre Processing : #500 Vitrified Bond Wheel
Removal Stock : 30um
Spindle Speed : 3000rpm
Table Speed : 300rpm
Air Cut : 30sec
F1 Feed Rate : 20um/sec
F2 Feed Rate : 10um/sec
Spark Out : 3sec
Slow Up F : 20um/sec
Slow Up T : 3um/sec
TTV : ≦2um