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“VEGA” Porous Vitrified Bond Wheel for Wafers Finishing Grinding

“VEGA” Porous Vitrified Bond Wheel for Wafers Finishing Grinding

Product summary

Higher surface roughness realized by intermediate processing and final processing of silicon and SiC wafers
■Higher surface roughness is realized by the combination of ultra-fine diamond abrasive grains and vitrified bonds of large and fine porous combination structure.
■Spontaneous blade generation is realized and cutting quality is maintained by bonds that can make ultrafine shredding.
■Stable high-quality surface and low processing cost can be realized.

Details of a product

“VEGA” Porous Vitrified Bond Wheel for Wafers Finishing Grinding
<Processing condition>
Wheel Spec. : SD6000 VZP-20 φ300D
Machine : Vertical Grinder @ NTS
Material : 12” Silicon Wafer 1pc/batch
Pre Processing : #500 Vitrified Bond Wheel
Removal Stock : 30um
Spindle Speed : 3000rpm
Table Speed : 300rpm
Air Cut : 30sec
F1 Feed Rate : 20um/sec
F2 Feed Rate : 10um/sec
Spark Out : 3sec
Slow Up F : 20um/sec
Slow Up T : 3um/sec
TTV : ≦2um

Ra=1.91nm  Rq=2.40nm
Rz=18.67nm  Rt=20.25nm

Component Material of the Tools・Bond

Vitrified bond

Use

Glass、Ceramics、Semiconductor wafers、GaN、SiC、Lithium tantalate、Lithium niobate、Quartz、Polycrystalline silicon

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