“DEX Duo” Electroplated Wheel for Hard Brittle Materials
“Gran DEX” Electroplated Wheel for Hard Brittle Material
■ Abrasive grain intervals are widened by controlling the abrasive grain density in the electroplating. This can reduce grinding resistance during rough grinding of hard, brittle materials such as glass or ceramics, and realize high-level cutting performance even in deep grinding.
■ Life of the wheel is extended significantly with tipping and surface roughness maintained at the same level as in conventional electroplated wheels.
■ Clogging can be reduced by widening the abrasive grain interval.
“Metalist” CBN Metal Bond Wheel for Iron Material
By using the metal bond having significantly higher heat conduction than a vitrified bond, the influence of heat on the working surface is minimized.
■ The product not only maintains cutting performance and realizes long tool life, but also suppresses burning of work materials.
■ Since it can suppress heat stress on work materials more than conventional abrasive wheels, reduction of the fatigue-resistant strength of the work can be suppressed.
■ Little damage on abrasive grains and appropriate spontaneous blade generation can realize long dress intervals and reduce down time.
“Chemex” Resin Bond Wheel for Wafers Polishing Grinding
“Chemex” resin bond wheel realizing fixed abrasive in silicon wafer polishing
■“Chemex” wheel uses chemical action together with mechanical action to realize fixed abrasive polishing instead of conventional loose abrasive polishing.
■The target is to achieve high-quality surface like slurry.
■Wheels of the structure most suitable for work material or purpose can be proposed.
“VEGA” Porous Vitrified Bond Wheel for Wafers Finishing Grinding
Higher surface roughness realized by intermediate processing and final processing of silicon and SiC wafers
■Higher surface roughness is realized by the combination of ultra-fine diamond abrasive grains and vitrified bonds of large and fine porous combination structure.
■Spontaneous blade generation is realized and cutting quality is maintained by bonds that can make ultrafine shredding.
■Stable high-quality surface and low processing cost can be realized.
Diamond wheels for beveling semiconductor wafers
The "ME" and "MC4" metal bonds have higher cutting performance and durability than conventional bonds. By using a forming technology, they reduce the amount of polishing required after beveling work. Since this reduces the processing time and saves consumable supplies, the total processing cost is reduced. Wheels of desired groove shapes can be made owing to our advanced groove forming technology.Electroplated wheels using ultrafine abrasive grain are also available.
Diamond notch wheel for semiconductor wafers
This wheel is used for the high-precision notch grinding of semiconductor wafers. Our original processing technology realizes high swinging accuracy of the diamond part against the shank. Wheels with various specifications, such as a wheel with optimized groove shape for sapphire wafers or a wheel for mirror beveling are also available.
“CITIUS” diamond wheels for heavy grinding of carbide tools
These wheels demonstrate their distinguished performance for deep-gutter flute grinding of carbide tools. Compared to conventional resin bond wheels, they reduce machining time and abrasion. They also achieve stable cutting performance, high-precision, and high-quality surface roughness, and reduce the generation of chips. "BI30" and "MB" series resin bond wheels are also available depending on the materials to be ground and on usage.