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Diamond wheels for beveling semiconductor wafers

Diamond wheels for beveling semiconductor wafers

The "ME" and "MC4" metal bonds have higher cutting performance and durability than conventional bonds. By using a forming technology, they reduce the amount of polishing required after beveling work. Since this reduces the processing time and saves consumable supplies, the total processing cost is reduced. Wheels of desired groove shapes can be made owing to our advanced groove forming technology.Electroplated wheels using ultrafine abrasive grain are also available.

Diamond notch wheel for semiconductor wafers

Diamond notch wheel for semiconductor wafers

This wheel is used for the high-precision notch grinding of semiconductor wafers. Our original processing technology realizes high swinging accuracy of the diamond part against the shank. Wheels with various specifications, such as a wheel with optimized groove shape for sapphire wafers or a wheel for mirror beveling are also available.

“CITIUS” diamond wheels for heavy grinding of carbide tools

“CITIUS” diamond wheels for heavy grinding of carbide tools

These wheels demonstrate their distinguished performance for deep-gutter flute grinding of carbide tools. Compared to conventional resin bond wheels, they reduce machining time and abrasion. They also achieve stable cutting performance, high-precision, and high-quality surface roughness, and reduce the generation of chips. "BI30" and "MB" series resin bond wheels are also available depending on the materials to be ground and on usage.

“Metarex” diamond wheels for high-efficient grinding of difficult-to-cut materials

“Metarex” diamond wheels for high-efficient grinding of difficult-to-cut materials

These metal bond wheels are designed with a new concept, and have both the high cutting performance of resin bonds and the abrasion resistance of metal bonds. They are suitable for efficient grinding of difficult-to-cut materials such as Al2O3-TiC and quartz.

Diamond pellet wheel for surface grinding of hard brittle materials

Diamond pellet wheel for surface grinding of hard brittle materials

This wheel takes full advantage of aligned pellets for large-area surface grinding of materials such as quartz and ceramics in situations where flatness and cutting performance are required. Various pellet shapes and bonds are available to meet material features and wheel usage requirements.

Diamond wheel for surface grinding of hard brittle materials

Diamond wheel for surface grinding of hard brittle materials

This wheel is designed for surface grinding of electronic or semiconductor materials such as ceramics, quartz, and sapphires. The ""G2(G square)"" porous vitrified bond ensures high cutting performance and efficient, precision grinding can be achieved
if the wheel is combined with special segment shapes.

Diamond wheel for chamfering glass substrates

Diamond wheel for chamfering glass substrates

This chamfering wheel is designed to maintain substrate strength when fabricating glass display panels. Wheels for facilitating high-speed substrate feeding are available for various machines.

Diamond wheels for mirror finishing of difficult-to-cut materials

Diamond wheels for mirror finishing of difficult-to-cut materials

"BL" porous resin bond wheels are designed for mirror grinding of carbide alloy molds, ceramics, silicon wafers, and hardening steel alloys. With the effect of pores and a heat-resistant bond strengthened by special filler, these wheels produce high quality finished surfaces while maintaining their cutting performance.

Diamond wheel for forming hard brittle materials

Diamond wheel for forming hard brittle materials

The "MF50" metal bond wheel is used for fine ceramics forming, glass substrate chamfering, and the forming of other hard brittle materials. Its advantages include high cutting performance and low grinding noise.

“DEX” diamond wheels for chamfering glass disks

“DEX” diamond wheels for chamfering glass disks

These wheels are used to chamfer the inner diameter (ID) or outer diameter (OD) edge of glass disks. Due to the special electroplating used in this design, the roughness of chamfered surfaces are improved and chipping at the boundary area to the edge surface is minimized. Wheels using micron size abrasive grain are available.