“Chemex” Resin Bond Wheel for Wafers Polishing Grinding
“Chemex” resin bond wheel realizing fixed abrasive in silicon wafer polishing
■“Chemex” wheel uses chemical action together with mechanical action to realize fixed abrasive polishing instead of conventional loose abrasive polishing.
■The target is to achieve high-quality surface like slurry.
■Wheels of the structure most suitable for work material or purpose can be proposed.
“VEGA” Porous Vitrified Bond Wheel for Wafers Finishing Grinding
Higher surface roughness realized by intermediate processing and final processing of silicon and SiC wafers
■Higher surface roughness is realized by the combination of ultra-fine diamond abrasive grains and vitrified bonds of large and fine porous combination structure.
■Spontaneous blade generation is realized and cutting quality is maintained by bonds that can make ultrafine shredding.
■Stable high-quality surface and low processing cost can be realized.
“Metarex” diamond wheels for high-efficient grinding of difficult-to-cut materials
Diamond pellet wheel for surface grinding of hard brittle materials
Diamond wheel for surface grinding of hard brittle materials
This wheel is designed for surface grinding of electronic or semiconductor materials such as ceramics, quartz, and sapphires. The ""G2(G square)"" porous vitrified bond ensures high cutting performance and efficient, precision grinding can be achieved
if the wheel is combined with special segment shapes.
“DEX” diamond wheel for optical lens centering
This wheel is used for axis alignment (optical lens centering) of aspherical lenses or steppers used in high-grade cameras or endoscopes, which usually require high-precision grinding. When used, pre-conditioning grinding is not necessary and lens manufacturing with less damage on the lens edge starts from the beginning of processing work. The wheel can also suppress lens coloring, even when a steep rise shape is used.