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“Arcceed” diamond cutting tool

“Arcceed” diamond cutting tool

This is a single-crystal diamond radius cutting tool with a cutting edge waviness of 50 nm or less. It realizes high-precision machining, thus reducing mold production processing requirements. Due to its fine rake and clearance surface, it can elicit better performance of a 3-axis machining device and improve the copying performance of molds. It also realizes high-precision machining by a 2-axis machining device.

“Arcceed” diamond end mill

“Arcceed” diamond end mill

This high quality single-crystal diamond ball end mill can be used at speeds up to 100,000 revolutions per minute (RPM). It has a fine cutting edge and a low axis deviation. W.A.90 products will be available.

“Squeed” diamond cutting tool

“Squeed” diamond cutting tool

High quality single-crystal diamond cutting tools for creating smooth finished surface of the optical device molds.

“Miracle” diamond cutting tools

“Miracle” diamond cutting tools

These are single-crystal diamond cutting tools for producing smooth mirror surfaces. They are used for photoconductive drums (for cylinder), polygon mirrors (for end face), etc.

Diamond forming cutting tool

Diamond forming cutting tool

This is a single-crystal diamond forming cutting tool manufactured using our forming and polishing technology. It realizes forming mirror machining for high-precision production of complex shapes consisting of plastics or soft metals.

Multi-angle diamond cutting tool

Multi-angle diamond cutting tool

This versatile single-crystal diamond cutting tool can be used with the cutting edge fixed at an arbitrary angle. Since the cutting edge is attached to a special, replaceable type chip, the tool is easy to use and contributes to machining cost reductions.

Diamond wheels for beveling semiconductor wafers

Diamond wheels for beveling semiconductor wafers

The "ME" and "MC4" metal bonds have higher cutting performance and durability than conventional bonds. By using a forming technology, they reduce the amount of polishing required after beveling work. Since this reduces the processing time and saves consumable supplies, the total processing cost is reduced. Wheels of desired groove shapes can be made owing to our advanced groove forming technology.Electroplated wheels using ultrafine abrasive grain are also available.

Diamond notch wheel for semiconductor wafers

Diamond notch wheel for semiconductor wafers

This wheel is used for the high-precision notch grinding of semiconductor wafers. Our original processing technology realizes high swinging accuracy of the diamond part against the shank. Wheels with various specifications, such as a wheel with optimized groove shape for sapphire wafers or a wheel for mirror beveling are also available.

“CITIUS” diamond wheels for heavy grinding of carbide tools

“CITIUS” diamond wheels for heavy grinding of carbide tools

These wheels demonstrate their distinguished performance for deep-gutter flute grinding of carbide tools. Compared to conventional resin bond wheels, they reduce machining time and abrasion. They also achieve stable cutting performance, high-precision, and high-quality surface roughness, and reduce the generation of chips. "BI30" and "MB" series resin bond wheels are also available depending on the materials to be ground and on usage.

“Metarex” diamond wheels for high-efficient grinding of difficult-to-cut materials

“Metarex” diamond wheels for high-efficient grinding of difficult-to-cut materials

These metal bond wheels are designed with a new concept, and have both the high cutting performance of resin bonds and the abrasion resistance of metal bonds. They are suitable for efficient grinding of difficult-to-cut materials such as Al2O3-TiC and quartz.